Àíãëî-ðóññêèé òåðìèíîëîãè÷åñêèé ñëîâàðü ïî ìèêðî- è íàíîñèñòåìíîé òåõíèêå - ñîäåðæàíèå

À              228

Ablation              228

Absorption              228

Accelerometer                228

Accelerated life testing              228

Accuracy              228

Acid              228

Actuator              228

Acoustic electromotive force element              229

Action potential              229

Active area              229

Active catheter              229

Active layer              229

Adenosine TriPhosphate (ATP)              229

Adhesion               229

Adhesive bonding              229

Adjustment              229

Adsorption              230

Aliasing              230

Aligner              230

Alignment              230

Alloy expansion actuator              230

Ambient              230

Amorphous silicon (a-Si)               230

Amplification              231

Anchor              231

Annealing              231

Anisotropic etching              231

Anisotropy              231

Anodic bonding              231

Application-Specific Integrated Circuit (ASIC)              231

Aqueous              232

ARDE (Aspect Ratio Dependent Etching)              232

Area array              232

Argon              232

Artificial organ              232

Ashing              232

Aspect ratio              232

Assembly              232

Astigmatic focus error detection              232

Atomic Force Microscope (AFM)              232

Autonomous distributed control              233

              233

Back-grinding              233

Backside patterning              233

Baked              233

Bandwidth              233

Batch fabrication              234

BAW sensor              234

Beam              234

Beam processing              234

Behavioral model              234

BioMEMS              234

Bimetal              234

Biomimetics              234

Birds beak               235

Boat              235

Bode plot              235

Bonding              235

Bond pad              235

Boron etch stop technique              235

Boule              235

Boundary              236

Boundary Element Analysis (BEA)              236

Bow              236

Breaking strength              236

Buckminsterfullerene              236

Buckyball              236

Buffered Oxide Etch (BOE)              236

Build-in              237

Bulk micromachining              237

Bumping              237

Buried layer              237

Burn-in              237

C              237

Caltech Intermediate Format (CIF)              237

Cantilever              237

Capacitive displacement meter              237

Capacitor              237

Carbohydride              238

Carbon Nanotube (CNT)              238

Carriers              238

Castiglianos theorem              238

Catalyst              238

Cauchy number              238

Cell              238

Cell fusion              239

Cell surgery              239

Ceramic              239

Cermet              239

Charge density              239

Charge Coupled Device (CCD)              239

Chemical bearing              239

Chemical Mechanical Polishing (CMP)              239

Chemical Vapour Deposition (CVD)              240

Chemo-Mechanical Planarization (CMP)              240

Chromatography              240

Circuit layout              240

Clamp              240

Clean room              240

Closed-loop feedback              240

Coating              240

Coefficient of static friction              241

Coefficient of Thermal Expansion (CTE)              241

Coherently Diffracting Domains (CDD)              241

Comb drive              241

Compound              241

Computer-Aided Design (CAD)              241

Concentration dependent etching              241

Conductor              241

Conformal              242

Conservation law              242

Contact lithography              242

Contact printing              242

Copolymer              242

Cost of ownership              242

Coupling coefficient              243

Covalent bond              243

Cross-axis sensivity              243

Cross section              243

Crucible              243

Ciystal orientation              243

Curie point              243

Curve fitting              243

Czochralski method              244

D              244

Damascene              244

Damping matrix              244

Deep Reactive Ion Etching (DRIE)              244

Deflection              244

Deformation              244

Deionized water              244

Dendrimer              244

Density              245

Deposition              245

Descum              245

Design kit              245

Design layout and validation              245

Design of Experiments (DOE)              245

Design rules              245

Deviation              245

Devitrification              245

Device              246

Die              246

Dielectric constant              246

Differential Algebraic Equations              (DAEs)              246

Difference quantity              246

Diffraction              246

Diffusion              246

Diffusion bonding              247

Diffusion gauge              247

Dislocation                247

Dissolved wafer process              247

Doping              247

Dose (Q)              247

Drift                                          248

Dry etching              248

Dry strip              248

Durability              248

E              248

Efficiency              248

Ejection              248

Elasticity              249

Elastomer              249

Electrochemical etch stop technique              249

Electrochemical passivation technique              249

Electro-Discharge Machining (EDM)              249

Electroforming              250

Electromagnetic actuator              250

Electromagnetic waves              250

Electromigration              250

Electron              251

E-beam lithography (electron beam              lithography)              251

Electronic Design Automation              (EDA)              251

Electronic nose (e-nose)              251

Electron Probe MicroAnalysis (EPMA)                 251

Electroplate              252

Electrostatic actuator              252

Electrostatic Discharge (ESD)              252

Electrostatic Force Microscope              (EFM)              253

Ellipsometer              253

Emitter              253

Emulsion mask              253

Enthalpy              254

Enzymes              254

Epipoly              254

Epitaxy              254

Equilibrium process              254

Equilibrium state              254

Etchback planarization              255

Etch hole              255

Etching              255

Etch pit              255

Etch profile              255

Etch rate               255

Etch stop              255

Etch-stop technique              256

Ethylene Diamine Pyrocatechol (EDM)              256

Ethylene glycol              256

Eutetic bonding              256

Eutetic point              256

Evaporation              256

Excimer laser              256

Eximer laser micromachining              257

Exposure              257

Extrinsic              257

F              257

Fabrication              257

Fault models              258

Ferroelectric              258

Film electrostatic actuator              258

Finite Element Analysis (FEA)              258

Fixed-fixed beam              259

Flagellar motor              259

Flat pack              259

Flexible microactuator              259

Flip chip              259

Flow quantity              260

Flow sensor              260

Fluorosilicate Glass (FSG)              260

Focused Ion Beam (FIB)               260

Focused ion beam machining              260

Foundry              261

Fourier number              261

Frequency              261

Frequency domain              261

Frequency response              261

Friction              261

Froude number              262

Fullerene              262

Fusion bonding              262

G              263

Gain              263

Gallium arsenide (GaAs)              263

Gap              264

Gap model              264

Gel              264

Germanium              264

Gettering              264

Glass              264

Glassivation              264

Grain              265

Graphic Design Station II (GDSII)              265

Grinding              265

Groove              265

H              265

Hall effect sensor              265

Hard bake               265

Hardened photoresist              266

Hardness              266

Hardware Description Language (HDL)              266

HDL-A/MS              266

Hertz              266

Heteroepitaxy              266

Hexamethyl Disilazane (HM DS)              266

High Aspect Ratio Micromachining (HARM)              267

High-Efficiency Particle Air (HEPA)              267

High energy ion implantation              267

High pressure oxidation              267

Hillock              268

Hole              268

Homoepitaxy              268

Homogeneous              268

Honing              268

Hot embossing              268

Hydraulic actuator              269

Hydrazine              269

Hydrofluoric acid (HF)              269

Hydrogen              269

Hydrogen storage alloy              269

Hysteresis cycle              270 270

Implantation              270

Impurity              271

Inductively coupled plasma              271

Inductor              271

Inertial sensor              272

Infrared              272

In homogeneous              272

Insulator              272

Integrated chemical analyzing system              272

Integrated Circuit (IC)              273

Integrated mass flow controller              273

Integrated MicroEIectroMechanical              Systems (IMEMS)              273

Integrated microprobe              274

Integrated optics              274

Integrated strain sensor              274

Intelligent sensor              274

Interconnect, interconnection              275

Interferometer              275

Interlevel planarization               276

Intrinsic              276

Ion              276

Ion beam etching              276

Ion beam machining              277

Ion beam milling              277

Ion implantation              278

Ion plating              278

Ion Sensitive Field Effect Transistor (ISFET)              279

Ionized metal plasma physical vapor deposition              279

Ionic bond              279

Isolation              279

Isolation diffusion              280

Isotropic              280

Isotropic etching              280

Isovalent doping              280

J              281

Josephson junction              281

Joule effect              281

Junction              282

Junction Field Effect Transistor (JFET)              282

Ê              283

Killer defect              283

Kilo              283

Kinesin              283

KirchHoffian Network (KHN)              283

Known Good Die (KGD)              284

KrI               284

L              284

Lab-on-chip              284

Laminar flow              285

Langmuir-Blodgett film              285

Lapping              285

Laser-assisted Chemical Vapour Deposition              (LCVD)              285

Laser drilling              286

Laser interferometry              286

Laser tweezers              286

Lattice              286

Layer thickness              286

Layer Thickness Variation (LTV)              287

Layout              287

Leadframe              287

Leakage current              287

Left-hand orthogonal crystallographic axial              set              287

Lewis acid              287

Lewis base              288

Lift-off technique              288

LIGA              288

Light driven actuator              289

Light scattering              289

Linear actuator              289

Linearity              289

Liquid crystal              289

Lithography              291

Loaded brush               292

Localized Electrochemical Deposition (LED)              292

LOCOS (LOCal Oxidation of Silicon)              292

Lost wafer process              292

Low-ê material              292

Low Pressure Chemical Vapor Deposition (LPCVD)              293

Low Temperature Oxide (LTO)              293

Luminescence              293

Lumped parameters              294

M              294

M3S (Modular Monolithic MEMS)              294

Magnetoresistive Random-Access Memories              (MRAMs)              295

Mask              295

Mechanical shock              295

Melt              295

MEMCAD (MicroElectroMechanical Computer-Aided Design)              295

MEMS Industry Group (MIG)              296

Mesoscale machining              296

Metallization              296

Microchamber              296

Microcutting and grinding              296

Microdrilling              296

MicroElectroMechanical Systems (MEMS)              296

Microelectronics Center of North Carolina              (MCNC)              297

Microengineering              297

MicroFlumes (Micro Fluidic molecular systems)              297

Microforging              297

Microgripper              297

Microgyroscopy              297

Microinjection Molding (MIM)               297

Micromilling              298

Micromirrors              298

Micromolding              298

Micron              298

Micro Optical Electro Mechanical Systems (MOEMS)              298

Micropump              299

Microrelay              299

Microscopic surgery              299

Microsensor              299

Microstructures              300

Microsystems technology              300

Microswitch               300

MicroTAS (MicroTotal Analysis System, mTAS)              300

Microtechnology              300

Microtribology              300

Microtweezer              301

Microvalve              301

Microwave              301

Miller index              301

Modification              302

Modified Nodal Analysis (MNA)              302

Modular System for Constraint Nonlinear Microsystem Optimization

(MOSC1TO)              303

Mohs’ scratch hardness              303

Molecular dynamics              303

Molecular Beam Epitaxy (MBE)              304

Molecular layer epitaxy              304

Monte-Carlo method              304

Moore’s law              304

MOSIS (Metal Oxide Semiconductor Implementation System)              304

Movable part              305

Moving mask lithography process              305

Multidomain system              305

Multipole              305

Multi-User MEMS Process (MUMPs)              305

Murphy-Seeds model              307

N              307

Nanometer              307

Nanotechnology              307

Native oxide              307

Negative lithography              307

Negative resist              307

Netlist              307

Nitinol (nickel titanium alloy)              308

Nitric acid (HN03)              308

Nitride              308

Nitrogen              308

Nitrous oxide (N20)               308

Nodal analysis              308

Node              309

Noise density              309

Non-contact handling              309

Nonlinearity              309

Notch              309

Novolak              309

Numerical Aperture (NA)              309

N-well              309

Π             309

Ohmic contact              309

Operating temperature              310

Optical attenuator              310

Optical lithography              310

Optical Proximity Correction (OPC)              310

Optical pyrometer              310

Optoceramic materials              310

Ordinary Differential Equations (ODEs)              310

Osmosis              310

Outgassing              311

Overlay              311

Overlay budget              311

Oxidation              311

Oxygen              311

P              311

Package              311

Packaging              312

Partial Differential Equations (PDEs)              312

Passivation              312

Patterned etching              312

Pattern generator              312

Pattern wafers              313

Patterning              313

Pellicle              313

Perovskite              313

Phase transition              313

Phonon              313

Phosphine              314

Phosphorus              314

Photo-Acid Generator (PAG)              315

Photodiode              315

Photolithography              315

Photomask              316

Photopolymerizalion              316

Photoresist              316

Photostrictive actuator              317

Photostrictive effect              317

Photovoltaic cell              317

Physical Liquid Deposition (PLD)              318

Piezoceramic              318

Piezoelectric actuator              318

Piezoelectric constant              319

Piezoelectric linear actuator              319

Piezoelectric material              319

Pinhole              320

Pipe inspection microrobot              320

Plasma Enhanced Chemical Vapor Deposition (PECVD)              321

Plasma etching              321

Plastic defonnalion              322

Plasticizer              322

PLZT              322

Pneumatic rubber actuator              322

Point defects              322

Poisson’s ratio              323

Polimer              323

Polishing              324

Polishing pads              324

Polycide              324

PolyDiMethylSiloxane (PDMS)              324

Polyimide              325

Polymer actuator              325

PolyMethylMethAcrylate (PMMA)              325

Polysilicon (polycrystalline silicon)              325

PolyVinyliDene Chloride (PVDC)              326

PolyVinyliDeneFlouride (PVDF)              326

Porosilicon              326

Positive photoresist              328

Post-Exposure Bake (PEB)              328

Potassium hydroxide (KOH)              328

Powder blasting              328

Power              329

Precise positioning              329

Precision              329

Precursor              329

Pressure sensor              329

Principal Component Analysis (PCA)              329

Probing              329

Process design rules              329

Projection lithography              329

Proof mass              330

Proximity aligner              331

Proximity lithography              331

P-type silicon              331

Purge              331

Pyrex              331

Pyroelectric              331

Pyrolysis              332

PZT              332

Q              332

Quad Flat Pack (QFP)              332

Quadrupole illumination              332

Quadrupole Mass Analyzer (QMA)              332

Qualification              332

Quality Factor (Q Factor)              333

Quantum dot              333

Quantum physics              333

Quantum well              334

Quartz              334

Quartz micro balance sensor module              334

R              335

Radical              335

Radio Frequency (RF)              335

Range              335

Rapid Thermal Processing (RTP)              335

RCA clean              335

Reaction Injection Molding (RIM)              335

Reactive Ion Etching (RIE)              335

Reactivity              335

Recombinant DNA              336

Recrystallization              336

Redistribution              336

Reduced system              336

Reduction              336

Reflow              336

Refractive index              336

Refractory              337

Registration overlay              337

Release etch              337

Released layers              337

Remanent polarization              337

Repeatability              337

Replication              337

Reproducibility (of measurement)              337

Residual stress              337

Resistance              337

Resolution              337

Resonator              337

Response characteristic              338

Response time              338

Reticle              338

Retrograde well              338

Reynolds number              338

RF MEMS              339

RF sputtering              339

Rhodopsin              339

RiboNucleic Acid (RNA)              339

Right-hand orthogonal crystallographic axial set              339

Rinse              339

Rochelle salt              339

Rotaiy actuator              339

S              340

Sacrificial anode              340

Sacrificial layer              340

Sacrificial Layer Etching (SLE)              340

Scale effect              340

Scaling              341

Scanning Electron Microscope (SEM)              341

Scanning Probe Microscope (SPM)              342

Scanning Tunneling Microscope (STM)               342

Schottky contact              342

Schottky defect              343

Schottky diode              343

Secondary Ion Mass Spectroscopy (SIMS)              343

Secondary structure of protein              344

Selective etching              344

Selectivity              344

Self-assembly              344

Self-heating              345

Semiconductor              345

Sensitivity              346

Separation by Implantation              of Oxygen (SI MOX)              346

Shape memory alloy              346

Shape memory alloy actuator              346

Shape memory effect              346

Shape memory polymer              347

Sheet resistance              347

Shim              347

Shredinger Wave Equation              (SWE)              347

Shrinkage              348

Signal-to-Noise Ratio (SNR)              348

Silane (SiH4)              348

Silicon              348

Silicon dioxide              348

Silicon fusion bonding              348

Silicon nitride              349

Silicon on Insulator (SOI)              349

Silicon on Sapphire (SOS)              350

Silicon tetrachloride              351

Simulation              351

Simulation Program for Integrated Circuits Emphasis (SPICE)              351

Single crystal              351

Single Crystal Reactive Ion Etching and Metallization (SCREAM)              351

Single Electron Device (SED)              351

Sintering              352

Slip              352

Slurry              352

Smart actuator              352

Smart dust              352

Smart pill              352

Smart sensor              353

Smart surface              353

Soft bake              353

Soft lithography              353

Sol-gel conversion actuator              353

Solid state              353

Solid-state image sensor              354

Solvent                 354

Span              354

Specific heat              354

Spider bonding              354

Spin coating              354

Spontaneous emission              354

Spontaneous polarization              355

Sputtering              355

Stability              355

Standard atmosphere              355

Standard Hydrogen Electrode (SHE)              355

Static frictional force              355

Stator              355

Steady state analysis              355

Step coverage              355

Step response              356

Stepper              356

Stereochemistry              356

Stereolithography              356

Stiction              357

Stiffness              357

Stimulated emission              357

Stoichiometry              357

Strain              357

Strain gauge              357

Stress              357

Stress corrosion (cracking)              358

Stripping              358

Structural material               358

Structure unit              358

SU-8               358

Subset              358

Substrate              358

SUMMiT (Sandia Ultra Planar Multi-level MEMS Technology)              358

Superconduction levitated actuator              359

Superconductivity              359

Superconducting quantum interference device (SQUIDS)              359

Superconductor              359

Superlattice              359

Surface Acoustic Wave (SAW) actuator              360

Surface Acoustic Wave (SAW) sensors              360

Surface micromachining              361

Surface Mount Technology (SMT)              361

Surface passivation              361

Surface roughness              362

Surface smoothness              362

Surface tension              362

Swell              362

System-level model              362

T              362

Tactile sensor              362

Taper              362

Tape Automated Bonding (TAB)              362

Taq DNA polymerase              363

Target              363

Taxonomy              363

Temperature Coefficient of Resistance (TCR)              364

Tensile strength              364

Terminal              364

Tertiary structure of protein              364

Tesla              364

Tetra Ethyl Ortho Silane (TEOS)              364

Tetra Methyl Ammonium Elydroxide (TMAH)              364

Thermal actuator              365

Thermal conductivity              365

Thermal expaasion coefficient              365

Thermistor              365

Thennocompression bonding              366

Thermocouple              366

Thermoplastic polymer              366

Thermoset polymer              366

Thermosonic bonding              367

Thick film technology              367

Thin film technology              367

Threshold              367

Time-consuming              367

Titanium nitride              367

Titatium silicide              368

Torque              368

Torr              368

Torsional micromirror              368

Total Thickness Variation (TTV)              368

Toughness              368

Transcription              368

Transducer              368

Transduction mode (direct              or indirect)               369

TRNA (Transfer RNA)              369

Transient analysis              369

Transient response              369

Transistor              369

Translation              370

Transmission Electron Microscope (ÒÅÌ)               370

Trench              370

Tribology              370

Trigger              370

Twinning              371

Twin well              371

Tungsten Hexaflouride              371

Tungsten Inert Gas (TIG)              371

Turbulent flow              371

Type              371

U              371

U-groove              371

Ultra High Frequency (UHF)              371

Ultra Large Scale Integration              (ULSI)              371

Ultra Low Penetration Air              (ULPA)              371

Ultrascope              371

Ultrasonic bonding              371

Ultrasonic impact grinding              372

Ultrasonic motor              372

Ultra Thin Silicon on Sapphire (UTSi)              372

Ultraviolet cleaning              373

Ultraviolet laser exposure              373

Ultraviolet rays (UV)              373

Uncover              373

UnderBump Metallization              (UBM)              373

Undercoat              373

Undercutting              373

Undoped              373

Unexposed              373

Unipolar              373

Unit cell              374

Utility fog              374

V              374

Vacancy              374

Vacuum infrared process              375

Vacuum microelectronics device              375

Valence electrons              375

Van der Pauw method              375

Van der Waals forces              375

Vapor deposition              376

Vapor plating              376

Vapor priming              376

Varactor              376

Variable gap electrostatic actuator              376

Verification              377

Vertical-Cavity Surface-Emitting Laser (VCSEL)              377

Very high-speed integrated-circuit Elardware Description Language

(VHDL)              377

V-groove              377

Via hole              377

Vibration sensor                            377

Viscous force              377

Visible light              378

VisSim              378

Vitrification              378

Volatile              378

W              378

Wafer              378

Wafer bonding              378

Wafer fabrication              379

Wafer size              379

Wafer yield              379

Wafers boat              379

Water deionization              379

Watt (W)              379

Waveguide              379

Wave equation                379

Wavelength              379

Wear              379

Weber              380

Weber number              380

Welding              380

Well              380

Wet anisotropic etching              380

Wet etching              381

Wet oxidation              381

Wetting              381

Whisker              381

Wire bonding              382

Wobble motor              382

Working plate              383

Wurtzite structure              383

X              383

X-Ray              383

X-Ray Fluorescence (XRF)              383

X-Ray lithography              384

X-ray Photoelectron Spectroscopy (XPS)              384

Y              385

Yaw rate sensor              385

Yellow room              385

Yield              385

Yield model              385

Yokogawa differential resonant pressure sensor              385

Young modulus              386

Yo-yo              386

Yttrium Aluminum Garnet (YAG)              386

Yttrium Barium Copper Oxide (YBACUO)              386

Yttrium Iron Garnet (YIG)              386

Yttrium iron garnet filter              386

Z              386

Zapper (laser)              386

Zener diode              386

Zephyr              386

Zero offset              386

Zeta potential              386

Zinc oxide              387

Zinc sulfide              387

Zirconate              387

Zirconium              387

Zirconium oxide              387

Zone leveling              387

Zone melting              387

Zone refining              388